Products/Service
Hakodate Electronics Co., Ltd. uses the technology cultivated through integrated IC manufacturing in the post-semiconductor process,We assemble and process semiconductors with a focus on gold stud bump processing.
Gold Stud Bump
- Si,Crystal,GaAs Wafer & Chip Piece
- Wafer Size (8¡ímax)
- Bump Pitch (30¦Ìm min)
Dicing
- Si Wafer (8¡ímax)
- Crystal
Die Sorting
- Si Wafer (8¡ímax)
- 2¡í and 3¡í trays
Die Bonding
- Si Dies & GaAs Dies
- Crystal
- Applicable 2¡í and 3¡í trays
Wire Bonding
- Die; Si, Crystal, GaAs
- Wire; Au
- Substrate; Glass-Epoxy, Ceramic
LED chip probe
- The upper surface / top and bottom erectrode 2-6inches
- Back surface 2-4inches
- Integrating sphere 2-4inches
¢¨Erectric characteristic / Brightness / Wavelength measurement / Examination for ESD
LED chip Sort
- Sheet ring sequence / 100
- classifications / 2-6inches
